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Shenzhen Hengxunda Circuit Technology Co.,LTD

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doule sided pcb printed cirucit board 2layers pcb riged double side fr4 printed circuit boards cald pcb double sided

Name: doule sided pcb printed cirucit board 2layers pcb riged double side fr4 printed circuit boards cald pcb double sided
Brand: Hengxunda
Price: 0.1 USD

China doule sided pcb printed cirucit board 2layers pcb riged double side fr4 printed circuit boards cald pcb double sided factory

Place of Origin : China

Certification : ISO 9001,UL,CE,ROHS

MOQ : 1pcs

Price : USD 0.1-5/pcs

Delivery Time : 5-7working days

Payment Terms : T/T or PAYPAL, Western Union

Supply Ability : 10000pcs/day

Packaging Details : 25kgs/carton, vacuumed packing

Brand Name : Hengxunda

Model Number : PCB20058A1

Base Material : FR-4

Copper Thickness : 1oz

Board Thickness : 1.6mm

Min. Hole Size : 0.2MM

Min. Line Width : 0.2MM

Min. Line Spacing : 0.2MM

Surface Finishing : Lead-Free+immersion gold

Board Size : Customized

Impedance Control : Yes

Material : FR-4

Min Hole Size : 0.2mm

Min Trace Width/Space : 4/4mil

Product Name : Double Sided PCB

Silkscreen Color : White

Solder Mask Color : Green

Surface Finish : HASL

Warranty : 1 Year

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Process Capability And Checking Parameters(Hard Board)
NO	ITEM	Technical Capabilities
1	Layers	1-38L
2	Max.Board Size	1200*610mm
		48"*24"
3	Finished Board Thickness	0.2mm--10.0mm
		0.008"--0.4"
4	Finished Copper Thickness	17um-420um
		0.5OZ--12OZ
5	Min.Trace Width/Space	0.075mm/0.065mm
		0.003"/0.0026"
6	Min.Hole Size	0.15mm
		0.006"
7	Hole Dim. Tolerance(PTH)	±0.05mm
		±0.002"
8	Hole Dim.Tolerance(NPTH)	±0.05mm
		±0.002"
9	Drill Location Tolerance	±0.05mm
		±0.002"
10	V-Cut Degrees	20-90 ºC
		20DEG-90DEG
11	Min.V-Cut PCB Thickness	0.4mm
		0.016"
12	N/C Routing Tolerance	±0.1mm
		±0.004"
13	Min.Blind/Buried Via	0.15mm
		0.06"
14	Plug Hole Size	0.2mm--0.6mm
		0.008"--0.024"
15	Min.BGA PAD	0.2mm
		0.008"
16	Materials	FR4(TG130-TG170),Aluminium,Halogen-free,Rogers,ShengYi,KB

17	Surface Finish	HASL-LF,ENIG,ImAg,ImSn,OSP,Gold platting, ENIG+OSP,HAL+G/F

18	Warp & Twist	≤0.75%

19	Electrical Testing	50--300V

20	Solderability Testing	245±5ºC,3sec Wetting area least95%

21	Thermal Cycling Testing	288±5ºC,10sec,3cycles

22	Ionic Contamination Testing	Pb,Hg,Cd,Cr(VI),PBB,PBDE six items are less than 1000ppm

23	Soldmask Adhesion Testing	260ºC+/-5, 10S,3times

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