| Process Capability And Checking Parameters(Hard Board) |
| NO | ITEM | Technical Capabilities |
| 1 | Layers | 1-38L |
| 2 | Max.Board Size | 1200*610mm |
| 48"*24" |
| 3 | Finished Board Thickness | 0.2mm--10.0mm |
| 0.008"--0.4" |
| 4 | Finished Copper Thickness | 17um-420um |
| 0.5OZ--12OZ |
| 5 | Min.Trace Width/Space | 0.075mm/0.065mm |
| 0.003"/0.0026" |
| 6 | Min.Hole Size | 0.15mm |
| 0.006" |
| 7 | Hole Dim. Tolerance(PTH) | ±0.05mm |
| ±0.002" |
| 8 | Hole Dim.Tolerance(NPTH) | ±0.05mm |
| ±0.002" |
| 9 | Drill Location Tolerance | ±0.05mm |
| ±0.002" |
| 10 | V-Cut Degrees | 20-90 ºC |
| 20DEG-90DEG |
| 11 | Min.V-Cut PCB Thickness | 0.4mm |
| 0.016" |
| 12 | N/C Routing Tolerance | ±0.1mm |
| ±0.004" |
| 13 | Min.Blind/Buried Via | 0.15mm |
| 0.06" |
| 14 | Plug Hole Size | 0.2mm--0.6mm |
| 0.008"--0.024" |
| 15 | Min.BGA PAD | 0.2mm |
| 0.008" |
| 16 | Materials | FR4(TG130-TG170),Aluminium,Halogen-free,Rogers,ShengYi,KB |
| 17 | Surface Finish | HASL-LF,ENIG,ImAg,ImSn,OSP,Gold platting, ENIG+OSP,HAL+G/F |
| 18 | Warp & Twist | ≤0.75% |
| 19 | Electrical Testing | 50--300V |
| 20 | Solderability Testing | 245±5ºC,3sec Wetting area least95% |
| 21 | Thermal Cycling Testing | 288±5ºC,10sec,3cycles |
| 22 | Ionic Contamination Testing | Pb,Hg,Cd,Cr(VI),PBB,PBDE six items are less than 1000ppm |
| 23 | Soldmask Adhesion Testing | 260ºC+/-5, 10S,3times |
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| Process Capability - Technical Parameters(FPC) | | |
| Content | Common | Special | Surface treatment | Thickness | | |
| Minimum line width | 0.07mm | 0.05mm | Electroplated nickel gold | Ni:3-9um;Au:0.03-0.1um | | |
| Minimum line spacing | 0.07mm | 0.05mm | | |
| Minimum Drilling aperture | Φ 0.15mm | Φ 0.1mm | | |
| Aperture Tolerance | ±0.1mm | ±0.05mm | Chemical immersion gold | Ni:3-5um;Au:0.03-0.1um | | |
| Maximum imposition size (single panel) | 610mm*1200mm(Exposure limit) | 250mm*35mm(only develop test samples) | | |
| Maximum imposition size (double panel) | 610mm*1200mm(Exposure limit) | 250mm*35mm(only develop test samples) | | |
| Maximum imposition size (single panel & double panel no PTH self-drying ink + UV light solid) | 610*1650mm | Electroplated hard gold | Ni:2-9um;Au:0.1-0.3um | | |
| Finished board impedance tolerance | ±10% | Electroplated pure tin | Sn:3-7um | | |
| Maximum production layer | 12L | | |
| Thickness To Diameter Ratio | 2:1(Minimum aperture 0.1mm) | | |
| 5:1(Minimum aperture 0.2mm) | Anti-oxidation | | | |
| 8:1(Minimum aperture 0.3mm) | | |
| Monthly production capacity/m² | 16000 m² | | |
| | | |
| Material | | |
| Substrate Material | PI(0.5mil,1mil,2mil),PET(0.5mil,1mil) | | |
| Conductive Medium | Copper foil(1/3oz,1/2oz,1oz,2oz) | | |
| Constantan | | |
| Silver Paste | | |
| Copper Ink | | |
| Adhesive | Epoxy resin, Acrylic, Adhesion | | |
| Solder Mask / Protective Film | PI(0.5mil,1mil,2mil)(Yellow, White, Black) | | |
| PET(1mil,2mil) | | |
| Solder mask (green, yellow, black...) | | |
| Glue | 3M467,3M468,3M9077,TESA8853... | | |
| Reinforcement Type | PI,FR4,PET,Steel,Aluminum... | | |
